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Suresh Sachdev, Director, Contract Manufacturing & Procurement Operation
Intel Corporation
Current Affiliations:
Director, Contract Manufacturing, Procurement, and Acquisition Integration
Intel Corporation
Background and Qualifications:
PROFESSIONAL HISTORY
INTEL
Director, Contract Manufacturing, Procurement, and Acquisition Integration, (2000-Present)
Santa Clara, CA
Manages worldwide external semiconductor manufacturing, assembly subcontracting and memory suppliers with annual spends of more than a billion dollars. Also Directs due diligence and integration for acquired company operations; past acquisitions included Giga, Lightlogic, Basis, and VxTel.
- Exceeded business needs by supporting operational requirements for all external silicon and assembly for wireless, chipset and flash products.
- Saved over $700M in cost reductions in the last 3 years.
- Prevented revenue loss by successfully managing business continuity challenges at subcontractors and suppliers.
- Facilitated the Centrino program by utilizing external manufacturing to surpass manufacturing build requirements for wireless products.
- Worked as a team member with Bain consulting, as a member of the corporate efficiency and identified cost reduction opportunities > $100M for the next 3 years in external manufacturing and direct materials.
- Created a successful team and drove them to become a second validation engineering group for chipset products.
General/Factory Manager, Assembly Test Manufacturing, (1996-1998)
Penang/Malaysia
Served as a co-manager at the company's largest assembly/test manufacturing plant with more than 4,000 employees. Oversaw commodity plant operations.
- Initiated a $300M assembly/test factory for microprocessors within time constraints and implemented a new package technology into volume manufacturing.
- Transferred more than 50% of mature products assembly to subcontractors and achieved output and cost reduction goals.
- Bolstered employee morale by implementing personnel confidence-building initiatives.
Director, Manufacturing Operations and Engineering, Chipset Division, (1994-1996)
Folsom, CA
Served as a member of the management team, which initiated and developed chipset business. Oversaw manufacturing operations, engineering, and P&L for the smaller mature part of the business. Supervised a team accountable for product engineering, quality, test, and package development. Utilized contractors throughout the US, Malaysia, Israel, and Japan to meet supply needs.
- Doubled a business's supply line within two years due to successful operational strategies and development and support initiatives.
- Eliminated customer and product quality problems through aggressively directing quality control programs, which resulted in Intel chipsets becoming the best in class.
Previous experience at Intel included serving as a senior process engineer, program manager, and manufacturing integration manager. Critical successes included developing flash memory process, advanced interlayer and passivation technologies. Coordinated resolution of long-standing worldwide factory quality and yield challenges
Education:
Executive M.B.A., Management, PEPPERDINE UNIVERSITY
M.S., Ceramic Engineering, UNIVERSITY OF ILLINOIS
B.Tech (Hons), Ceramic Engineering, INSTITUTE OF TECHNOLOGY, BHU, INDIA
Member IEEE
Awards:
Received three team Intel Achievement Awards and two team Intel Quality Awards